Low Melting Materials Customized High Quality Phase Change Material For Notebook
TIC™812G series is low melting point thermal interface material. At 50℃, TIC™800G series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.
TIC™812G series is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance.
TIC™812G Series shows no thermal performance degradation after 1,000 hours@130℃,or after 500 cycles, from -25℃ to 125℃.The material softens and does not fully change state resulting in minimal migration (pump out)at operating temperatures.
TIC800G Series Datasheet-(E)-REV01.pdf
Applications Include:
> High Frequency Microprocessors
> Notebook and Desktop PCs
> Computer Serves
> Memory Modules
> Cache Chips
> IGBTs
Features:
For Lowest Thermal Resistance :
> 0.014℃-in² /W thermal resistance
> Naturally tacky at room temperature,
no adhesive required
> No heat sink preheating required
| Typical Properties of TICTM812G Series |
| Product Name | TICTM805G | TICTM808G | TICTM810G | TICTM812G | Test Method |
| Color | Gray | Gray | Gray | Gray | Visual |
| Thickness | 0.005"
(0.126mm) | 0.008"
(0.203mm) | 0.010"
(0.254mm) | 0.012"
(0.305mm) | |
| Thickness Tolerance | ±0.0008''
(±0.019mm) | ±0.0008''
(±0.019mm) | ±0.0012''
(±0.030mm) | ±0.0012''
(±0.030mm) | |
| Density | 2.6g/cc | Helium Pycnometer |
| Temperature range | -25℃～125℃ | |
| Phase Change Softening Temperature | 50℃~60℃ | |
| Thermal Conductivity | 5.0 W/mK | ASTM D5470 (modified) |
| Thermal Impedance @ 50 psi(345 KPa) | 0.014℃-in²/W | 0.020℃-in²/W | 0.038℃-in²/W | 0.058℃-in²/W | ASTM D5470 (modified) |
| 0.09℃-cm²/W | 0.13℃-cm²/W | 0.25℃-cm²/W | 0.37℃-cm²/W |
Standard Thicknesses:
0.005"(0.127mm) 0.008"(0.203mm) 0.010"(0.254mm) 0.0012"(0.305mm)
Consult the factory alternate thickness.
Standard Sizes:
10" x 16"(254mm x 406mm) 16" X 400' (406mm X 121.92M)
TIC™800 series are supplied with a white release paper and a bottom liner. TIC800™ series is available in kiss cut an extended pull tab liner or individual die cut shapes.
Peressure Sensitive Adhesive:
Peressure Sensitive Adhesive is not applicable for TIC™800 series products.
Reinforcement:
No reinforcement is necessary.
Packaging Details & Lead time
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company Profile
With professional R&D capabilities and over 18 year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality control''.
2.Our core competencies is thermal conductive interface materials.
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract.
5.Free sample offer.
6.Quality assurance contract.
FAQ
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China.
Q: How long is your delivery time?
A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.
Q: Do you provide samples ? is it free or extra cost?
A: Yes, we could offer samples free of charge.
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Low Melting Materials Customized High Quality Phase Change Materials For Notebook Images
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