Cache Chips Gray 2.5 W/MK No Heat Sink Preheating Required Phase Changing Materials

Cache Chips gray 2.5 W/mK No heat sink preheating required phase changing materials

The TIC™808A is low melting point thermal interface material. At 50℃, The TIC™808A Series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.The TIC™808A Series is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance.

The TIC™808A shows no thermal performance degradation after 1,000 hours@130℃,or after 500 cycles, from -25℃ to 125℃.The material softens and does not fully change state resulting in minimal migration (pump out)at operating temperatures.

TIC800A Series Datasheet-(E)-REV01.pdf

Features:

> 0.018℃-in² /W thermal resistance
> Naturally tacky at room temperature, no adhesive required
> No heat sink preheating required

Applications:

> High Frequency Microprocessors

> Notebook and Desktop PCs
> Computer Serves
> Memory Modules
> Cache Chips
> IGBTs

Typical Properties of TIC™800A Series
Product Name	TICTM803A	TICTM805A	TICTM808A	TICTM810A	Testing standards
Color	Ashy	Ashy	Ashy	Ashy	Visual
Composite Thickness	0.003" (0.076mm)	0.005" (0.126mm)	0.008" (0.203mm)	0.010" (0.254mm)
Thickness Tolerance	±0.0006" (±0.016mm)	±0.0008" (±0.019mm)	±0.0008" (±0.019mm)	±0.0012" (±0.030mm)
Density	2.5g/cc				Helium Pycnometer
Work Temperature	-25℃～125℃
phase transition temperature	50℃~60℃
Thermal conductivity	2.5 W/mK				ASTM D5470 (modified)
Thermal lmpedance @ 50 psi(345 KPa)@ 50 psi(345 KPa)	0.018℃-in²/W	0.020℃-in²/W	0.047℃-in²/W	0.072℃-in²/W	ASTM D5470 (modified)
	0.11℃-cm²/W	0.13℃-cm²/W	0.30℃-cm²/W	0.46℃-cm²/W

Standard Thicknesses:

0.003"(0.076mm) 0.005"(0.127mm) 0.008"(0.203mm) 0.010"(0.254mm)
Consult the factory alternate thickness.

Standard Sizes:

9" x 18"(228mm x 457mm) 9" x 400'(228mm x 121M)
TIC™800 series are supplied with a white release paper and a bottom liner. TIC™800 series is available in kiss cut an extended pull tab liner or individual die cut shapes.

Peressure Sensitive Adhesive:

Peressure Sensitive Adhesive is not applicable for TIC™800 series products.

Reinforcement:

No reinforcement is necessary.

thermal insulating materials

heat sensitive materials

Cache Chip phase changing materials

Cache Chips Gray 2.5 W/MK No Heat Sink Preheating Required Phase Changing Materials Images