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Electrically Isolating Thermal Gap Filler Pad For Memory Modules 5.0 W/Mk

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Electrically Isolating Thermal Gap Filler Pad For Memory Modules 5.0 W/Mk

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Brand Name : ZIITEK

Model Number : TIF120-50-11US

Certification : UL and RoHs

Place of Origin : China

MOQ : 1000pcs

Price : negotiation

Supply Ability : 100000pcs/day

Delivery Time : 3-5 work days

Packaging Details : 1000pcs/bag

Heat Capacity : 1 l/g-K

Thermal conductivity : 5.0 W/m-K

Hardness : 20 Shore 00

Density : 2.9 g/cc

Continuos Use Temp : -40 to 160℃

Flame rating : 94 V0

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Electrically isolating UL recognized TIF120-50-11US thermal pad for Memory Modules ,5.0 W/mK

The TIF120-50-11US is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling.

TIF100-50-11US-Datasheet-REV02.pdf


Features

> Good thermal conductive: 5.0 W/mK

>Thickness:0.5mmT

>hardness:20 shore00

>Colour: Gray

>Good thermal conductive

>Moldability for complex parts

>Soft and compressible for low stress applications

Applications

>mainboard/mother board

>notebook

>power supply

>Heat pipe thermal solutions

>Memory Modules

>Mass storage devices

Typical Properties of TIF120-50-11US Series
Color
gray
Visual
Composite Thickness
Thermal Impedance@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone elastomer
***
10mils / 0.254 mm
0.16
20mils / 0.508 mm
0.20

Specific gravity
2.9g/cc
ASTM D297
30mils / 0.762 mm
0.31
40mils / 1.016 mm
0.36
Thickness
0.5mmT
***
50mils / 1.270 mm
0.42
60mils / 1.524 mm
0.48
Hardness
20 Shore 00
ASTM 2240
70mils / 1.778 mm
0.53
80mils / 2.032 mm
0.63
Outgassing(TML)
0.4%
ASTM E595
90mils / 2.286 mm
0.73
100mils / 2.540 mm
0.81
Continuos Use Temp
-40 to 160℃
***
110mils / 2.794 mm
0.86
120mils / 3.048 mm
0.93
Dielectric Breakdown Voltage
>5500 VAC
ASTM D149
130mils / 3.302mm
1.00
140mils /3.556 mm
1.08
Dielectric Constant
4.2 MHz
ASTM D150
150mils / 3.810 mm
1.13
160mils / 4.064 mm
1.20
Volume Resistivity
1.0X1012
Ohm-cm
ASTM D257
170mils / 4.318 mm
1.24
180mils / 4.572 mm
1.32
Fire rating
94 V0
equivalent
UL
190mils / 4.826 mm
1.41
200mils / 5.080 mm
1.52
Thermal conductivity
5.0 W/m-K
ASTM D5470
Visua l/ ASTM D751
ASTM D5470

Company Profile

With professional R&D capabilities and over 13 year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.

Peressure Sensitive Adhesive:

Request adhesive on one side with "A1" suffix.

Request adhesive on double side with "A2" suffix.

Reinforcement: TIF™ series sheets type can add with fiberglass reinforced.

Electrically Isolating Thermal Gap Filler Pad For Memory Modules 5.0 W/Mk

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Product Tags:

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