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Highest Thermal Gap Filler , Thermal Conductive Pad For Electronics Heat Transfer

Name: Highest Thermal Gap Filler Thermal Conductive Pad For Electronics Heat Transfer
Brand: ZIITEK
Price: 1 USD

Cheap Highest Thermal Gap Filler , Thermal Conductive Pad For Electronics Heat Transfer for sale

Brand Name : ZIITEK

Model Number : TIF860HP

Certification : UL and RoHs

Place of Origin : China

MOQ : 1000pcs

Price : negotiation

Supply Ability : 10000/day

Delivery Time : 3-5work days

Packaging Details : 1000pcs/bag

Thermal conductivity& Compostion : 12 W/m-K

Density（g/cm3） : 3.55

Dielectric Constant : 4.5 MHz

Color : gray

Continuos Use Temp : -40 to 160℃

Thickness : 1.25mmT

applications : electronics

usage : heat transfer

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Highest Thermal Gap Filler , Thermal Conductive Pad For Electronics Heat Transfer

The TIF860HP

use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.

Features:

Available in varies thicknesses 12 W/mK

Broad range of hardnesses available

Moldability for complex parts

Outstanding thermal performance

High tack surface reduces contact resistance

Applications:

Memory Modules

Mass storage devices

Automotive electronics

Set top boxes

Audio and video components

IT infrastructure

GPS navigation and other portable devices

CD-Rom, DVD-Rom cooling

LED Power Supply

Typical Properties of TIF860HP
Color	gray	Visual	Composite Thickness	hermalImpedance @10psi (℃-in²/W)
Construction & Compostion	Ceramic filled silicone elastomer	***	10mils / 0.254 mm	0.21
			20mils / 0.508 mm	0.27
Hardness(Shore00 Thickness ≥0.75mm)	40	ASTM D297	30mils / 0.762 mm	0.39
			40mils / 1.016 mm	0.43
Hardness(Shore00 Thickness ＜0.75mm)	65	ASTM C351	50mils / 1.270 mm	0.50
			60mils / 1.524 mm	0.58
Density(g/cm³)	3.55	ASTM 2240	70mils / 1.778 mm	0.65
			80mils / 2.032 mm	0.76
Thickness range	0.030''~0.200''	ASTM D412	90mils / 2.286 mm	0.85
			100mils / 2.540 mm	0.94
Continuos Use Temp	-40 to 160℃	***	110mils / 2.794 mm	1.00
			120mils / 3.048 mm	1.07
Dielectric Breakdown Voltage	≥5500 VAC	ASTM D149	130mils / 3.302mm	1.16
			140mils / 3.556 mm	1.25
Dielectric Constant	4.5 MHz	ASTM D150	150mils / 3.810 mm	1.31
			160mils / 4.064 mm	1.38
Volume Resistivity	1.0X10¹² Ohm-meter	ASTM D257	170mils / 4.318 mm	1.43
			180mils / 4.572 mm	1.50
Fire rating	94 V-0	equivalent UL	190mils / 4.826 mm	1.60
			200mils / 5.080 mm	1.72
Thermal conductivity	12 W/m-K	ASTM D5470	Visua l/ ASTM D751	ASTM D5470

Standard Sheets Sizes:

8" x 16"(203mm x 406mm) 16" x 18"(406mm x 457mm)
TIF™ series Individual die cut shapes can be supplied.

Peressure Sensitive Adhesive:

Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.

Reinforcement:

TIF™ series sheets type can add with fiberglass reinforced.

Highest Thermal Gap Filler , Thermal Conductive Pad For Electronics Heat Transfer

Why Choose us ?

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer
6.Quality assurance contract

Q: What's the thermal conductivity test method given on the data sheet ?
A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.

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Highest Thermal Gap Filler , Thermal Conductive Pad For Electronics Heat Transfer

Highest Thermal Gap Filler , Thermal Conductive Pad For Electronics Heat Transfer

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